- The Boundary-Scan Handbook | Kenneth P. Parker | Springer
- The boundary-scan handbook
- Integrating Boundary Scan With Various ATE
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With Free Saver Delivery. Facebook Twitter Pinterest Share. This updated edition features new chapters on the possible effects of the changes on the work of the practicing test engineers and the new Anyone needing to understand the basics of boundary scan and its practical industrial implementation will need this book. Provides an overview of the recent changes to the About the Author Dr. Kenneth P.
The Boundary-Scan Handbook | Kenneth P. Parker | Springer
He has recently retired from a career with Hewlett-Packard and Agilent Technologies in the field of testing of electrical assemblies. More Details Contributor: Kenneth P. Free Returns We hope you are delighted with everything you buy from us. However, if you are not, we will refund or replace your order up to 30 days after purchase. Terms and exclusions apply; find out more from our Returns and Refunds Policy.
Design Rule Checking DRC A physical design process to determine if chip satisfies rules defined by the semiconductor manufacturer. Design Rule Pattern Matching Locating design rules using pattern matching techniques.
The boundary-scan handbook
Device Noise Sources of noise in devices. Diamond Semiconductors A wide-bandgap synthetic material. Digital Oscilloscope Allowed an image to be saved digitally. DNA Chips Using deoxyribonucleic acid to make chips hacker-proof. Double Patterning A patterning technique using multiple passes of a laser. Double Patterning Methodologies Colored and colorless flows for double patterning. E-Beam Lithography using a single beam e-beam tool.
Edge Computing. Educational Establishments Educational establishments from which technology has been spawned into the EDA field. Electromigration Electromigration EM due to power densities. Emulation Special purpose hardware used for logic verification. Energy Harvesting Capturing energy from the environment. Environmental Noise Noise caused by the environment. Epitaxy A method for growing or depositing mono crystalline films on a substrate. Ethernet Ethernet is a reliable, open standard for connecting devices by wire.
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Fan-Outs A way of including more features that normally would be on a printed circuit board inside a package. Fault Simulation Evaluation of a design under the presence of manufacturing defects. Femtocells The lowest power form of small cells, used for home WiFi networks.
Fill The use of metal fill to improve planarity and to manage electrochemical deposition ECD , etch, lithography, stress effects, and rapid thermal annealing. FinFET A three-dimensional transistor. Flash Memory non-volatile, erasable memory. Flicker Noise Noise related to resistance fluctuation. Formal Verification Formal verification involves a mathematical proof to show that a design adheres to a property. Functional Coverage Coverage metric used to indicate progress in verifying functionality.
Functional Design and Verification Functional Design and Verification is currently associated with all design and verification functions performed before RTL synthesis.
Functional Verification Functional verification is used to determine if a design, or unit of a design, conforms to its specification. Gate-Level Power Optimizations Power reduction techniques available at the gate level.
Generation-Recombination Noise noise related to generation-recombination. Graphene 2D form of carbon in a hexagonal lattice.
Integrating Boundary Scan With Various ATE
Graphics processing unit GPU An electronic circuit designed to handle graphics and video. Guard Banding Adding extra circuits or software into a design to ensure that if one part doesn't work the entire system doesn't fail. Hardware Assisted Verification Use of special purpose hardware to accelerate verification. Hardware Modeler Historical solution that used real chips in the simulation process. Heat Dissipation Power creates heat and heat affects power. High-Bandwidth Memory HBM A dense, stacked version of memory with high-speed interfaces that can be used in advanced packaging.
IC Types. Impact of lithography on wafer costs Wafer costs across nodes. Implementation Power Optimizations Power optimization techniques for physical implementation. Induced Gate Noise Thermal noise within a channel. Integrated Circuits ICs Integration of multiple devices onto a single piece of semiconductor. Intellectual Property IP A design or verification unit that is pre-packed and available for licensing.
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Intelligent Self-Organizing Networks Networks that can analyze operating conditions and reconfigure in real time. Inter Partes Review Method to ascertain the validity of one or more claims of a patent. Interconnect Buses, NoCs and other forms of connection between various elements in an integrated circuit. Internet of Things IoT Also known as the Internet of Everything, or IoE, the Internet of Things is a global application where devices can connect to a host of other devices, each either providing data from sensors, or containing actuators that can control some function.
Interposers Fast, low-power inter-die conduits for 2. Ion Implants Injection of critical dopants during the semiconductor manufacturing process. ISO — Functional safety Standard related to the safety of electrical and electronic systems within a car. Languages Languages are used to create models. Level Shifters Cells used to match voltages across voltage islands. LIN bus Low cost automotive bus. Lint Removal of non-portable or suspicious code. Litho Freeze Litho Etch A type of double patterning. Lithography Light used to transfer a pattern from a photomask onto a substrate.
Lithography k1 coefficient Coefficient related to the difficulty of the lithography process. Logic Resizing Correctly sizing logic elements. Logic Restructuring Restructuring of logic for power reduction. Logic Simulation A simulator is a software process used to execute a model of hardware. Low Power.
Low Power Methodologies Methodologies used to reduce power consumption. Low Power Verification Verification of power circuitry. Low-Power Design. LVDS low-voltage differential signaling A technical standard for electrical characteristics of a low-power differential, serial communication protocol. Machine Learning ML An approach in which machines are trained to favor basic behaviors and outcomes rather than explicitly programmed to do certain tasks.
Manufacturing Noise Noise sources in manufacturing. Materials Semiconductor materials enable electronic circuits to be constructed. Memory A semiconductor device capable of retaining state information for a defined period of time. Memory Banking Use of multiple memory banks for power reduction.
mobber.com/401.php MEMS Microelectromechanical Systems are a fusion of electrical and mechanical engineering and are typically used for sensors and for advanced microphones and even speakers. Metamaterials Artificial materials containing arrays of metal nanostructures or mega-atoms. Metastability Unstable state within a latch. Methodologies and Flows Describes the process to create a product. Metrology Metrology is the science of measuring and characterizing tiny structures and materials. Mixed-Signal The integration of analog and digital. Models and Abstractions Models are abstractions of devices.
Monolithic 3D Chips A way of stacking transistors inside a single chip instead of a package. Mote A mote is a micro-sensor.